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MOSFET Parallel Current Sharing Calculator

Estimate static current distribution in a parallel MOSFET bank using nominal RDS(on), tolerance, hot-resistance multiplier, device count, and duty cycle.

The worst-case model assigns one device the minimum resistance and all remaining devices the maximum resistance to expose current and thermal imbalance before PCB verification.

Engineering tool

MOSFET Parallel Current Sharing Calculator

Estimate static current imbalance, worst-case device current, RDS(on) mismatch, and conduction loss for parallel MOSFETs.

Total on-state current delivered by the parallel MOSFET bank.

Enter a whole number of at least two devices.

Reference on-resistance at the selected VGS and temperature.

Worst-case resistance spread around the nominal value.

Temperature multiplier applied equally to minimum and maximum resistance.

Fraction of time the MOSFET bank conducts current.

Current sharing status

High Current Imbalance

The estimated lowest-resistance MOSFET carries substantially more than ideal current. Improve device matching, use symmetrical copper and source paths, consider source ballast, and verify individual junction temperatures.

Result console

Ideal current per MOSFET
10A
Worst-case high-current MOSFET
13.333333A
Other MOSFET current
8.888889A
Lowest hot RDS(on)
6
Highest hot RDS(on)
9
Worst-case device power
1.066667W
Total conduction loss
3.2W
Current sharing imbalance
33.333333%
Four parallel MOSFET current-sharing branchesTotal current enters four parallel MOSFET branches. The lowest-resistance device carries the worst-case current while the other devices carry lower current before recombining at the source return.ItotalSource returnM1IworstM2IotherM3IotherM4IotherSymmetrical source pathRDS(on) mismatch + heat affect current balance
Simplified static sharing model with one minimum-resistance MOSFET and the remaining maximum-resistance devices.

Formula reference

Parallel MOSFET Current Sharing Formulas

Current divides according to hot branch conductance. This static model does not include switching delay, common-source inductance, or transient gate mismatch.

Ideal current: Iideal = Itotal / NResistance limits: Rmin = RDS(on) × (1 − tolerance), Rmax = RDS(on) × (1 + tolerance)Hot values: Rmin,hot = Rmin × multiplier, Rmax,hot = Rmax × multiplierWorst-case current: Iworst = Itotal × (1/Rmin,hot) / [(1/Rmin,hot) + (N−1)(1/Rmax,hot)]Other-device current: Iother = (Itotal − Iworst) / (N−1)Worst-device loss: Pworst = Iworst² × Rmin,hot × DutyTotal loss: Ptotal = Pworst + (N−1) × Iother² × Rmax,hot × Duty

Variable definitions

Itotal
total bank drain current
N
number of parallel MOSFETs
Tolerance and duty are converted from percent to decimal
All internal current, resistance, and power calculations use SI units

Worked Example

Itotal = 40 A, N = 4, nominal RDS(on) = 5 mΩ, tolerance = 20%, hot multiplier = 1.5, and duty = 100%.

Iideal = 40 / 4 = 10 A

Rmin,hot = 5 mΩ × 0.8 × 1.5 = 6 mΩ; Rmax,hot = 5 mΩ × 1.2 × 1.5 = 9 mΩ

Iworst ≈ 13.333 A; each other device carries ≈ 8.889 A

Pworst ≈ 13.333² × 0.006 = 1.067 W

Ptotal ≈ 1.067 + 3 × (8.889² × 0.009) = 3.2 W

Current imbalance above ideal is approximately 33.33%.

Engineering Notes

Positive temperature behavior

MOSFETs can share current better than BJTs because RDS(on) often increases with temperature in normal conduction.

Static mismatch

Static sharing still depends on RDS(on) tolerance, package and source resistance, and local temperature.

PCB symmetry

Symmetrical drain, source, and Kelvin measurement paths are important for parallel MOSFET current balance.

Dynamic sharing

Individual gate resistors and small source resistors may improve dynamic and static sharing in demanding designs.

Thermal environment

Thermal coupling, heatsink contact, airflow, and nearby heat sources affect current balance and device stress.

Support reference

FAQ

Can MOSFETs be connected in parallel?

Yes. Parallel MOSFETs are commonly used to increase current capacity and reduce conduction loss, but their gate drive, PCB layout, thermal environment, and electrical parameters must support balanced operation.

How do parallel MOSFETs share current?

Static current divides approximately in proportion to each branch conductance, so a MOSFET with lower total drain-source path resistance carries more current than a higher-resistance device.

Why does RDS(on) tolerance matter?

RDS(on) variation changes branch conductance. The lowest-resistance MOSFET can carry more than the ideal current, increasing its local loss and thermal stress.

Do parallel MOSFETs need separate gate resistors?

Separate gate resistors are often useful for damping individual gate loops and improving dynamic sharing. Their values and placement should be verified with switching waveforms and layout parasitics.

How do you reduce current imbalance?

Use matched devices, symmetrical drain and source copper, equal gate paths, Kelvin source connections, thermal coupling, and where necessary small source-balancing resistors.

Documentation

Design notes, guides, and engineering articles linked to this tool.